发明名称 COOLING DEVICE FOR HEATING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a cooling device for a heating element that suitably cools the heating element.SOLUTION: The cooling device for the heating element includes a first radiator 4 which has a principal surface where the heating element is arranged and the other principal surface where a radiation portion 41 having a plurality of first projections 42a to 42e and a first junction 43 surrounding the radiation portion 41 are formed, and a second radiator 5 which has a second junction 52 having a junction surface 53 joined to a junction surface 44 of the first junction 43, and is combined with the first radiator 4 by joining the second junction 52 to the first junction 43 to receive the radiation portion 41 to form a refrigerant flow passage, the second radiator 5 having second projections 51a to 51f inserted between adjacent ones of the first projections 42a to 42e.
申请公布号 JP2011198820(A) 申请公布日期 2011.10.06
申请号 JP20100061087 申请日期 2010.03.17
申请人 NISSAN MOTOR CO LTD 发明人 UENO DAIGO
分类号 H01L23/473;H05K7/20 主分类号 H01L23/473
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