| 摘要 |
A display panel package structure is disclosed, which includes a first substrate, a metal wire layer formed on the first substrate, an insulating layer formed on the metal wire layer, a second substrate, a frit formed on an edge of the second substrate for sealing the first substrate and the second substrate, and a conductive layer formed between the frit and the insulating layer corresponding to the frit for conducting a heat when the frit is heated.
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