发明名称 |
Dummy Metal Design for Packaging Structures |
摘要 |
An integrated circuit structure includes a semiconductor chip, a metal pad at a major surface of the semiconductor chip, and an under-bump metallurgy (UBM) over and contacting the metal pad. A metal bump is formed over and electrically connected to the UBM. A dummy pattern is formed at a same level, and formed of a same metallic material, as the metal pad.
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申请公布号 |
US2011241202(A1) |
申请公布日期 |
2011.10.06 |
申请号 |
US20100750468 |
申请日期 |
2010.03.30 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIU TZUAN-HORNG;HOU SHANG-YUN;JENG SHIN-PUU;WU WEI-CHENG;WEI HSIU-PING;CHEN CHIH-HUA;KUO CHEN-CHENG;CHEN CHEN-SHIEN;TSENG MING HUNG |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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