发明名称 COOLING ARRANGEMENT
摘要 A cooling arrangement for cooling a heat generating electrical component is disclosed, which arrangement comprises a heat spreading element (2) having a mounting surface (3) adapted to be thermally connected to the heat generating electrical component (1), and a heat rejection surface (4). The arrangement further comprises an enclosure (5) arranged to cover the heat rejection surface (4) and form an essentially closed compartment; an opening (13) leading into the compartment; an annular member (11) coaxially aligned with the opening; and an actuator connected to the annular member (11), and arranged to move the annular member (11) reciprocating away from/toward the opening (13). The annular member (11) hence generates a jet directed through the opening (13) toward the outside of the enclosure (5).
申请公布号 US2011240260(A1) 申请公布日期 2011.10.06
申请号 US200913124427 申请日期 2009.10.12
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 VAN DER TEMPEL LEENDERT
分类号 F28F7/00 主分类号 F28F7/00
代理机构 代理人
主权项
地址