| 摘要 |
Disclosed is a multichip module which has an operation element, i.e., a semiconductor element that executes arithmetic processing, and a storage element, i.e., a semiconductor element that is connected to face the operation element and stores data. The multichip module has the operation element mounted thereon, and on the surface where the operation element is mounted, the multichip module has a package substrate having an external terminal connected to other component. Furthermore, on the package substrate surface on the reverse side of the surface having the external terminal thereon, the multichip module has a reinforcing member that is disposed to reinforce a part from the outer circumferential portion of the operation element to a predetermined position on the center portion side. |
