METHOD OF MANUFACTURING FLEXIBLE PRINTED WIRING BOARD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, FLEXIBLE PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible printed wiring board having superior heat dissipation efficiency.SOLUTION: A method of manufacturing a TCP-type flexible printed wiring board 12A includes a step of laminating an adhesive layer 1A on a metal base material film 1; a step of pasting conductor foil 2 to the adhesive layer 1A; a step of laminating a photoresist film 4 on the conductor foil 2; a step of exposing and developing the photoresist film 4; a step of coating the part of the metal base material film 1 not covered with the conductor foil 2 with an etching protection film 15; and a step of forming a conductive pattern 3, by etching the conductor foil 2 via the exposed and developed photoresist film 4 (developed pattern 4A), in a state where the etching protection film 15 is coated.