| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for electronic parts having excellent flexibility, good compatibility with an epoxy resin, and high heat resistance; an adhesive sheet using the same; and a copper foil having a resin.SOLUTION: The thermosetting resin composition for electronic parts includes an epoxy resin, a curing agent, and a modified polyvinyl acetal resin having a structural unit containing at least a vinyl alcohol unit, an acetal unit, an acetyl unit, and a crosslinkable group. The adhesive sheet using the thermosetting resin composition for electronic parts and a copper foil having a resin are also provided. |
