发明名称 METHOD FOR MANUFACTURING A DOUBLE-SIDED PRINTED CIRCUIT BOARD
摘要 Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuiting can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
申请公布号 WO2011122723(A1) 申请公布日期 2011.10.06
申请号 WO2010KR02028 申请日期 2010.04.02
申请人 INKTEC CO., LTD.;HAEUN CHEMTEC CO., LTD.;CHUNG, KWANG CHOON;HAN, YOUNG-KOO;YOO, MYUNG-BONG;CHO, NAM-BOO;HAN, YOUNG-HO;LEE, KYONG-MIN;YOON, KWANG-BAEK;AHN, HEE-YONG;KIM, SU-HAN 发明人 CHUNG, KWANG CHOON;HAN, YOUNG-KOO;YOO, MYUNG-BONG;CHO, NAM-BOO;HAN, YOUNG-HO;LEE, KYONG-MIN;YOON, KWANG-BAEK;AHN, HEE-YONG;KIM, SU-HAN
分类号 H05K3/12;H05K3/06;H05K3/28 主分类号 H05K3/12
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