发明名称 |
MICROPHONE INTEGRATED WITH INTEGRATED CIRCUIT |
摘要 |
An integrated circuit (1000) containing a capacitive microphone with a back side cavity (1026) located within the substrate (1002) of the integrated circuit. Access holes (1006) may be formed through a dielectric support layer (1004) at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity (1026). The back side cavity (1026) may be etched after a fixed plate (1010) and permeable membrane (1018) of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate. |
申请公布号 |
WO2011082250(A3) |
申请公布日期 |
2011.10.06 |
申请号 |
WO2010US62401 |
申请日期 |
2010.12.29 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED;TEXAS INSTUMENTS JAPAN LIMITED;SHIH, WEI-YAN |
发明人 |
SHIH, WEI-YAN |
分类号 |
H04R19/04 |
主分类号 |
H04R19/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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