| 摘要 |
<p>Certain example embodiments of this invention relate to silver pastes that are capable of making an electrical connection with at least one conductive layer in a layer stack, even where the at least one conductive layer is protected by one or more strong dielectric layers, and/or methods of making the same. Certain example embodiments include a chemically modified silver paste that may be cured or fired using a standard glass tempering furnace (e.g., an electrical or gas-fuelled furnace) or a short-wave infrared heating process at temperatures below 750 degrees C. In certain example embodiments, the fluorine causes apertures or micro-factures in the dielectric layer(s), which allows the silver in the paste to move therethrough (e.g., by capillary action) to form a contact with the conductive layer(s).</p> |
