CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

摘要

The disclosed circuit board comprises conductive layers (11b and 31) and an interlayer insulating layer (30a) laminated in alternation on at least one side of a core insulating layer (10a). The core insulating layer (10a) and the interlayer insulating layer (30a) each have a connecting conductor (12 and 32) comprising a hole (12a and 32a) filled with a plating material. The connecting conductor (12) in the core insulating layer and the connecting layer (32) in the interlayer insulating layer overlap. The core insulating layer and the interlayer insulating layer each have a connecting conductor land (13 and 33) formed thereupon, said connecting conductor lands each comprising a metal foil (13a and 33a) with plating (13b and 33b) formed on top of the metal foil. The metal foil (13a) in the land on the core insulating layer is thicker than at least the metal foil (33a) in the land on the interlayer insulating layer.