发明名称 POWER CONVERSION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a power conversion apparatus, wherein a temperature sensor can be installed easily and a measured temperature of a refrigerant is less likely to be influenced by specific semiconductor modules.SOLUTION: The power conversion apparatus includes a laminate 2, in which multiple semiconductor modules 20 and multiple cooling tubes 21 are stacked. A pair of pipes 3a, 3b is connected to the cooling tube 21a, located at one end part in the stacking direction X of the laminate 2. The laminate 2 and the pipes 3 are stored in a storage case 4. The pair of pipes 3 is fastened to the storage case 4 by respective fastening members 5. The pipes 3 include the introduction-side pipe 3a for introducing the refrigerant and the lead-out-side pipe 3b for leading out the refrigerant. The temperature sensor 6 for detecting the temperature of the refrigerant is attached to at least one fastening member 5 among a fastening member 5a for fastening the introduction-side pipe 3a and a fastening member 5b for fastening the lead-out-side pipe 3b.
申请公布号 JP2011200090(A) 申请公布日期 2011.10.06
申请号 JP20100067419 申请日期 2010.03.24
申请人 DENSO CORP 发明人 KAWAGUCHI KENJI;KOYAMA SHIKI
分类号 H02M7/48;H01L23/473;H01L25/07;H01L25/18;H02M1/00 主分类号 H02M7/48
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