| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive for electronic parts excellent in coating property when joining electronic parts and capable of obtaining an electronic part assembly excellent in contamination resistance to the joined electronic parts.SOLUTION: The adhesive for electronic parts includes a curable compound, a curing agent, inorganic fine particles, a polyether-modified siloxane, and an epoxy compound having various structures, in some cases, and further, spacer particles having a CV value of 10% or less. |
