SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a circuit board having high reliability in connecting a metal pattern with a via.SOLUTION: This semiconductor device has: a metal pattern 13 formed on an insulating film 12; a hole 11a which penetrates the insulating film 12 and the metal pattern 13; and a via 14 which is formed in the hole 11a, jointed to the metal pattern 13 in the hole 11a, and also has one end contiguous to an opposite face of the insulating film 12 of the metal pattern 13.