METHOD OF CUTTING SHEET, AND DEVICE OF CUTTING SHEET

摘要

PROBLEM TO BE SOLVED: To provide a method of cutting sheet and a device of cutting sheet reducing an uncut part at a notch portion in an adhesive sheet adhered to a wafer having a notch.SOLUTION: The adhesive sheet S is cut by moving a cutter 72 while rotating it so that a cutting edge is aligned with inclinations K1, K2 and a valley portion K3 of the notch K, whereby there is no uncut part of the adhesive sheet S at the portion of the notch K or only a minimum uncut part can be present. This can avoid that the uncut part of the adhesive sheet S may be stuck between the wafer W and a grinding saw to damage the wafer W and that the uncut part may be peeled off to allow the washing water to enter during a process of grinding a rear surface of the wafer W which is a post-process.