发明名称 MIXING DEVICE AND METHOD FOR MANUFACTURING A RESIN COMPOSITION FOR SEMICONDUCTOR SEALING
摘要 The disclosed mixing device (1) has a casing (2) and a pair of screws (4a and 4b) rotatably provided inside the casing (2). The casing (2) has a casing body (20) and an enclosure (3) which forms a mixing chamber (30) in which a resin composition is mixed. Each screw (4a) has: a screw shaft (41); and a screw member (42) and mixing members (43) provided on the outer surface of the screw shaft (41) and disposed inside the mixing chamber (30). The screw shafts (41), screw members (42), and mixing members (43) each have a core (411, 421, and 431) and an outer layer (45) provided on the surface of that core (411, 421, and 431). The housing (3) and the outer layers (45) are nonmetallic.
申请公布号 WO2011122212(A1) 申请公布日期 2011.10.06
申请号 WO2011JP54697 申请日期 2011.03.02
申请人 SUMITOMO BAKELITE COMPANY LIMITED;UEDA SHIGEHISA;NODA KAZUO 发明人 UEDA SHIGEHISA;NODA KAZUO
分类号 B01F7/08;B01F7/02;B01F15/00;B29B7/48 主分类号 B01F7/08
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