| 摘要 |
PROBLEM TO BE SOLVED: To provide a vibrator-type dynamic quantity sensor capable of forming a sensor element including a vibrator having a fixed part and a spindle provided to surround the outer diameter of the fixed part coupled via a plurality of beams in Si wafer batch processing using a SOI wafer, for example, and a method of manufacturing the sensor.SOLUTION: In the vibrator-type dynamic quantity sensor including a sensor element having the vibrator 11, the sensor element is formed of a semiconductor member, and the vibrator 11 includes the fixed part 12 and the spindle 14 provided to surround the outer diameter of the fixed part 12, which are coupled via a plurality of beams 13. Further, a glass substrate 101 is joined with one of the surfaces of the sensor element and the fixed part 12 is joined with the side of the glass substrate 101, whereby the vibrator 11 is mechanically supported by the glass substrate 101. |
