| 摘要 |
PROBLEM TO BE SOLVED: To ensure high precision and high reliability even when a semiconductor package is made compact by adjusting the amount of an adhesive for electronic component which protrudes from a junction region of a semiconductor chip or wafer.SOLUTION: A method of manufacturing an electronic component laminate having the semiconductor chip or wafer bonded to a substrate, the other semiconductor chip, or the other wafer through the adhesive for electronic component includes a coating process (1) of applying the adhesive for electronic component to the substrate, the other semiconductor chip, or the other wafer, a bonding process (2) of laminating the semiconductor chip or wafer on the substrate, the other semiconductor chip, or the other wafer through the applied adhesive for electronic component while heating and pressing them so that a region that the adhesive for electronic component spreads to wet is 60 to 100% of the junction region of the semiconductor wafer or wafer, and releasing them from being pressed thereafter; a process (3) of allowing the adhesive for electronic component to uniformly spread to wet the whole junction region of the semiconductor chip or wafer by heating the adhesive for electronic component; and a curing process (4) of curing the adhesive for electronic component. The region to which the adhesive for electronic component is applied in the coating process (1) is 40 to 90% of the junction region of the semiconductor chip or wafer, and the adhesive for electronic component has a viscosity of 20 to 100 Pa s at 0.5 rpm when the viscosity is measured at 25°C using an E type viscometer, and also has a viscosity of 4 to 25 Pa s at 0.5 rpm when the viscosity is measured at a bonding temperature using the E type viscometer, the viscosity at 0.5 rpm being 2 to 4 times as large as the viscosity at 5 rpm. |
