| 摘要 |
PROBLEM TO BE SOLVED: To form an adequate copper film having high adhesiveness even to an article to be plated which has high specific resistance such as an ITO film and a template of a copper electrode of a solar cell panel.SOLUTION: An electrolytic copper plating method is a method for forming a plating film on the article to be plated which has high specific resistance, wherein the plating film is an electrodeposited copper film formed by using an electrolytic copper plating bath; the electrolytic copper plating bath includes (a) a soluble copper salt, (b) a complexing agent selected from polyamines, aminocarboxylic acids and the like, and (c) an electroconductive salt selected from the group consisting of a halide and a sulfate of an alkali metal, an alkaline earth metal and ammonium; and the pH of the bath is controlled to 3-11. The copper plating bath combinedly contains a particular complexing agent and a particular electroconductive salt, and accordingly can form the adequate copper film having satisfactory adhesiveness even to the article to be plated which has high specific resistance such as the ITO film. |
