| 摘要 |
PROBLEM TO BE SOLVED: To provide a new temperature sensor unit which requires no extra cost because of requiring no re-creation of the whole mounting substrate which may become necessary when changing the specification of any existing temperature sensor even if the circuit for mounting other components needs not be changed.SOLUTION: The temperature sensor unit is composed of a FPC substrate mounted with a chip type temperature sensor and a circuit for adjusting its characteristics, and a substrate holder 6 formed of an insulative raw material in which a storage chamber for storing the chip type temperature sensor of the FPC substrate is internally formed to be coated on the chip type temperature sensor so as to cover surface on the side where such a sensor is mounted. A metal terminal 11 of a length slightly longer than the holder thickness including flat soldered portions at its upper/lower ends is vertically attached to at least four corners of the substrate holder so as to pierce front-back both sides where the soldered portion on a backside is solder-mounted on the terminal positioned suitable for the FPC substrate while the soldered portion on the topside is be solder-mounted on the flat terminal positioned suitable for the mounting substrate of an apparatus trying to monitor a rise in temperature, respectively. |
