发明名称 |
PROVIDING A PLASTIC SUBSTRATE WITH A METALLIC PATTERN |
摘要 |
The invention is directed to a method of providing a plastic substrate with a metallic pattern and to a plastic substrate with a metallic pattern obtainable by said method. The method of the invention comprises i) replicating a pattern of recesses and protrusions on a plastic substrate by pressing a stamp having recesses and protrusions against the substrate, thereby providing said plastic substrate with recesses and protrusions; ii) removing said stamp from said substrate; iii)—applying a layer of seed material capable of initiating an electroless or electrochemical metal deposition process onto said plastic substrate in a selective pattern at least in the recesses of said plastic substrate to yield a substrate wherein said seed material remains selectively in the recesses of said substrate; and thereafter iv) using said seed material to initiate a metal deposition process.
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申请公布号 |
US2011240350(A1) |
申请公布日期 |
2011.10.06 |
申请号 |
US20090994439 |
申请日期 |
2009.05.22 |
申请人 |
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJKONDERZOEK TNO |
发明人 |
MEINDER ERWIN RINALDO;PETER MARIA;FURTHNER FRANCOIS;TACKEN ROLAND ANTHONY |
分类号 |
H05K1/00;B05D3/00;B05D3/06;B05D5/12;B82Y99/00;C23C16/50;C25D5/02 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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