WIRING BOARD AND MANUFACTURING PROCESS FOR SAME

摘要

The disclosed wiring board (100) has: an insulation layer (10), which includes a silica-based filler (10a) and has had at least one surface roughened; and a conductive layer (20), which is formed on said roughened surface. The roughness of said surface (F3) between a first conductive part (20a) and an adjacent second conductive part (20b) of the conductive layer (20) is less than the roughness of said surface (F1) under the first conductive part (20a) and/or the roughness of said surface (F2) under the second conductive part (20b).