| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for forming solder, and a method and a device for soldering wire, capable of soldering wire to a substrate with a high strength, when solder is previously formed on a substrate composed of glass, ceramic, ITO, metals hard to be soldered, or the like, and when soldering is carried out by pressing the wire to a substrate side with a tip vibrated by ultrasonic wave and heated.SOLUTION: The method for forming solder is intended to form solder on a substrate 1 before soldering a wire 18 on the substrate 1. A string-like solder 27 is delivered to a side of a tip 24 vibrated by ultrasonic wave by a vibrator 31 and heated by heating means 26, and a belt-like solder layer 19 extending to a wiring direction is continuously formed on the substrate 1 by moving the tip along the wiring direction in a state of proximately placing or contacting the tip to the substrate 1. |
