| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module making a temperature sensor of a control IC suitably function, and suitably controlling a power semiconductor chip.SOLUTION: A first heat dissipation plate 31 has an extended part 31A extended toward a side having a second heat dissipation plate 32 in an arrangement direction of first lead terminals 21-24. The first lead terminals 21-24 are connected to a first side surface of the first heat dissipation plate 31, and function as an extraction electrode of a back electrode (D: drain electrode) of the power semiconductor chip 41. A second lead terminal 25 is connected to a bonding pad 411 working as a source electrode (S). Third lead terminals 26-28 are connected to an electrode of a control IC chip 42. The temperature sensor is formed on the power semiconductor chip side of the control IC. |
