| 摘要 |
PROBLEM TO BE SOLVED: To effectively cool the semiconductor device of a motor drive portion without the need for the increase in outside dimension.SOLUTION: A pump device includes a pump chamber A whose pump casing 50 houses a rotor 20 which has an impeller 30 and a plurality of magnets 21 and is rotatably attached to a shaft 10 and from which a fluid sucked is discharged, a motor chamber B whose motor casing 80 houses a stator 60 including a plurality of stator cores 61 and coils 63 which is annularly arranged in a position axially opposite to the magnets of the rotor and a motor drive portion 70 axially opposite to the stator and having a circuit substrate 71 mounted with a semiconductor device 72 for switching and controlling a current supplied to the coils, and a water-proof partition plate 90 between the pump chamber A and the motor chamber B. In addition, a heat conductor 65 is disposed between the water-proof partition plate and the semiconductor device in the inner circumferential side of the stator to heat-transferably connect the semiconductor device and the water-proof partition plate to each other. |
