发明名称 |
METHOD OF FORMING METAL FILM, METHOD OF MANUFACTURING TRANSMITTANCE CONTROL PLATE, AND METHOD OF MANUFACTURING WIRING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of chemical plating with high productivity.SOLUTION: The method of forming a metal film includes the steps of: forming a base film in which a functional fluid 18 is arranged on a substrate 2 and solidified to form a base film 40; and performing chemical plating treatment to form a metal film 45 on the film 40. The fluid 18 contains a resin, a metal catalyst, and a leveling agent. The catalyst is a silane coupling agent with a functional group including a metal. The fluid 18 is heated or is irradiated with light to solidify the fluid 18. |
申请公布号 |
JP2011195896(A) |
申请公布日期 |
2011.10.06 |
申请号 |
JP20100063918 |
申请日期 |
2010.03.19 |
申请人 |
SEIKO EPSON CORP |
发明人 |
HIRAI TOSHIMITSU;KAMAKURA TOMOYUKI |
分类号 |
C23C18/18;H05K3/10;H05K3/18 |
主分类号 |
C23C18/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|