发明名称 METHOD OF FORMING METAL FILM, METHOD OF MANUFACTURING TRANSMITTANCE CONTROL PLATE, AND METHOD OF MANUFACTURING WIRING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of chemical plating with high productivity.SOLUTION: The method of forming a metal film includes the steps of: forming a base film in which a functional fluid 18 is arranged on a substrate 2 and solidified to form a base film 40; and performing chemical plating treatment to form a metal film 45 on the film 40. The fluid 18 contains a resin, a metal catalyst, and a leveling agent. The catalyst is a silane coupling agent with a functional group including a metal. The fluid 18 is heated or is irradiated with light to solidify the fluid 18.
申请公布号 JP2011195896(A) 申请公布日期 2011.10.06
申请号 JP20100063918 申请日期 2010.03.19
申请人 SEIKO EPSON CORP 发明人 HIRAI TOSHIMITSU;KAMAKURA TOMOYUKI
分类号 C23C18/18;H05K3/10;H05K3/18 主分类号 C23C18/18
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