| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting liquid resin composition having suppressed mold shrinkage factor.SOLUTION: There are provided a thermosetting liquid resin composition comprising (A) a thermosetting liquid resin and (B) thermosetting resin particles; the thermosetting liquid resin composition wherein the reaction rate of the thermosetting resin particle (B) is ≥80% determined by heat-release value in DSC; and the above thermosetting liquid resin composition wherein the thermosetting liquid resin (A) is composed of the following components (C), (D) and (E): (C) a compound having two or more C-C double bonds reactive with an SiH group in one molecule, (D) a compound having at least two SiH groups in one molecule and (E) a hydrosilylation catalyst. |
