| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition which suppresses warp of a pseudo wafer causing degradation in the productivity of a wafer level package, and to provide a semiconductor package manufactured by using the liquid sealing resin composition.SOLUTION: The liquid resin composition contains (A) an epoxy resin, (B) an acid anhydride, (C) an inorganic filler, (D) a curing accelerator, and (E) a low stress material, wherein the solid form component is contained in an amount of 80-90 wt.% with respect to the whole liquid resin composition, and wherein the internal stress value (σ) obtained according to expression (1) is ≤20 MPa in a two layer state composed of a silicon wafer and a cured material of the liquid resin composition. In the expression (1), σ is internal stress, Eresin (T) is elastic modulus of the cured material of the liquid resin composition at a temperature T°C, αresin (T) is linear expansion coefficient of the cured material of the liquid resin composition at a temperature T°C, and αsi(T) is linear expansion coefficient of silicon at a temperature T°C. |
