METAL BASE SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要
<p>Disclosed is a manufacturing method of a metal base substrate which increases the reliability of bonding between a metal substrate and a low-temperature sintering ceramic layer in the metal base substrate in which a low-temperature sintering ceramic layer is formed on a metal substrate which is configured from copper. An unsintered laminate is produced by stacking on the surface of the cupreous metal substrate (14) low-temperature sintering ceramic green layers containing a low-temperature sintering ceramic material containing barium at 10-40 %mol in terms of BaO, and silicon at 40-80 %mol in terms of SiO2. This unsintered laminate is sintered at a temperature at which the low-temperature sintering ceramic green layers are sintered. A 1-5µm thick glass layer (22) comprising a Cu-Ba-Si-based glass is formed between the metal substrate (14) and the low-temperature sintering ceramic layers (15) on the metal base substrate (12) obtained in this way. This glass layer (22) has excellent bonding reliability.</p>
