| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate mounting and demounting method capable of preventing fine particles from getting stuck in a rear surface of a substrate.SOLUTION: A substrate processing apparatus includes an electrostatic chuck incorporating an electrostatic electrode plate to which a DC voltage is applied for attracting a wafer through electrostatic force generated due to the DC voltage applied to the electrostatic electrode plate, and a heat-transfer gas supply hole for supplying a helium gas into a heat-transfer gap between the attracted wafer W and the electrostatic chuck. When the DC voltage applied to the electrostatic electrode plate is increased while being gradually changed, pressure of the helium gas supplied to the heat-transfer gap is increased stepwise in response to the increase in the DC voltage. |
