发明名称 METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated electronic component, capable of increasing bonding strength between an internal electrode pattern and a dielectric layer while maintaining a function as the dielectric layer.SOLUTION: In the method of manufacturing a laminated electronic component 1, the internal electrode pattern 6 is formed on a support 20 so as to have a plurality of openings 22, and ceramic paste P2 containing large diameter ceramic particles A and small diameter ceramic particles B is imparted onto the internal electrode pattern 6 so as to fill the small diameter ceramic particles B in the openings 22 thereafter to form a green sheet 30. After laminating the green sheet 30 and forming a laminate, the laminate is cut and fired to form a plurality of component bodies 2, and a terminal electrode 4 is formed on the component body 2. In the manufacturing method, when the particle size of the large diameter ceramic particles A is defined as α, the particle size of the small diameter ceramic particles B is defined as β and the diameter of the openings 22 is defined as γ, the relation of the particle size α>the diameter γ>the particle size β is satisfied.
申请公布号 JP2011198936(A) 申请公布日期 2011.10.06
申请号 JP20100062819 申请日期 2010.03.18
申请人 TDK CORP 发明人 KIKUCHI SHOTA;MIZUNOYA ATSUSHI
分类号 H01G4/30;H01G4/12 主分类号 H01G4/30
代理机构 代理人
主权项
地址