| 摘要 |
A printed circuit board shield (100) is provided. The shield comprises a sealing surface (120) and a shielding surface (110). The sealing surface is configured to cooperate with, and be connectable to, a sealing region of a printed circuit board (80) upon assembly therewith. The shielding surface is substantially parallel to but offset from, the sealing surface. A concave cover for receiving at least part of the printed circuit board is thereby defined. The shielding surface comprises an array of perforations (130) formed therethrough. The array of perforations is configured to correspond to a location of an electronic component mounted on the printed circuit board. |
