MODULE BOARD FOR BALL GRID ARRY SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE HAVING THE MODULE BOARD AND METHOD OF MOUNTING THE SEMICONDUCTOR PACKAGE THEREON
摘要
申请公布号
KR20110110078(A)
申请公布日期
2011.10.06
申请号
KR20110083467
申请日期
2011.08.22
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, BYUNG MAN;PARK, CHANG YONG;LEE, DONG CHUN;KIM, YONG HYUN;KIM, KWANG SEOP;SHIN, DONG WOO;CHUN, KWANG HO
