| 摘要 |
PROBLEM TO BE SOLVED: To provide a hardenable composition which exhibits an excellent adhesivity after hardened and a dicing-die bonding tape using the hardenable composition.SOLUTION: The hardenable composition includes an epoxy resin having polar groups, a hardener for the epoxy resin, and an acrylic resin containing epoxy groups. The acrylic resin containing epoxy groups has a weight average molecular weight of 10,000-400,000, and a glass transition temperature of not lower than 60°C. The dicing-die bonding tape 1 is provided with an adhesive layer 3 composed of the hardenable composition, and a base layer 4 laminated on one side 3a of the adhesive layer 3. |
