| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module for avoiding a shortcircuited defect and an open defect in a mounted chip component.SOLUTION: Attention is focused on relative relation in thermal expansion coefficient between a mold resin 21 and an exterior resin 4 concerning a resin mold component 2. Then, the thermal expansion coefficient αA in the mold resin 21 at 250°C is set in the range of 250 μm/°C≤αA≤400 μm/°C, and the thermal expansion coefficient αB in the exterior resin 4 at 250°C is set in the range of 70 μm/°C≤αB≤200 μm/°C. The elastic moduli and glass transition points of the mold resin 21 and the exterior resin 4 may be set in specified ranges. |
