| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which adhesion between a resin layer and a conductive layer is enhanced.SOLUTION: A wiring board 2 has: a first resin layer 6e; and a first conductive layer 7a formed on the first resin layer 6e. The first conductive layer 7a has a metal carbide layer 7ax that includes a carbide of a transition metal belonging to Group IV, V, or VI of the Periodic Table and is bonded to the first resin layer 6e. The first resin layer 6e has a first region 6ej to which the metal carbide layer 7ax is bonded and a second region 6ek located closer to the first resin layer 6e than the first region 6ej. The first region 6ej has a greater ratio of the number of carbon atoms to the number of nitrogen atoms than the second region 6ek. |
