| 摘要 |
PROBLEM TO BE SOLVED: To provide methods of bonding substrates and of forming a sealing film, capable of achieving a sufficient contact width for reliably performing sealing and securing bonding strength between substrates.SOLUTION: The method of bonding substrates is the method of bonding them through a bonding film and includes: a first bonding film layer drawing step of impacting liquid droplets containing the material of the bonding film in a fist impact specified section comprising a plurality of impact point sections and drawing a first bonding film layer extending in the first direction on one substrate; and a second bonding film layer drawing step of impacting the liquid droplets containing the material of the bonding film in a second impact specified section comprising the plurality of impact point sections and drawing a second bonding film layer extending in the first direction superimposed on the first bonding film layer. The width of the second direction crossing the first direction of the first impact specified section is wider than the width of the second direction of the second impact specified section. |
