METHOD FOR PRODUCING COPPER-CLAD POLYIMIDE FILM SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for producing a copper-clad polyimide film substrate which does not have a fine depression on a metal layer surface to decrease a depression on the metal layer surface and a defect during wiring patterning.SOLUTION: A polyimide film is immersed and cleaned in an aqueous solution containing a primary amide compound and polyalkylene glycol. The timing of cleaning may be before or after forming a primary metal layer by a dry method, as long as it is before the copper layer to be a conductor is formed. It is also effective to treat twice before and after forming the primary metal layer by a dry method.