| 摘要 |
A backlight module includes a heat-dissipating element, at least one light-emitting element disposed on a first side of the heat-dissipating element, a back plate, and a heat-insulation element. The back plate has at least one opening and is disposed on the first side of the heat-dissipating element, and the back plate is not overlapped with the light-emitting element. The heat-insulation element is disposed between the back plate and the heat-dissipating element for reducing heat conduction between the back plate and the heat-dissipating element so as to prevent the heat generated by the light-emitting element from being conducted to the back plate.
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