发明名称 COMPOUND SEMICONDUCTOR SUBSTRATE, LIGHT EMITTING ELEMENT, METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a compound semiconductor substrate which has various superior characteristics of luminance, life etc., and excellent quality, and to provide a light emitting element, a method of manufacturing the compound semiconductor substrate, and a method of manufacturing the light emitting element.SOLUTION: The compound semiconductor substrate has at least a double-hetero-structure sequentially formed of a GaAs buffer layer, and (AlGa)InP (where 0<x<1, 0<y<1) on a GaAs substrate. A thickness of the GaAs buffer layer is 0.5 μm or more.
申请公布号 JP2011198807(A) 申请公布日期 2011.10.06
申请号 JP20100060833 申请日期 2010.03.17
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 TAKAHASHI MASANORI
分类号 H01L33/30 主分类号 H01L33/30
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