| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing agent coating method in which an internal pressure of a package does not increase and generation of a pin hole of a sealing part by a sealing agent is prevented in sealing the package using a thermosetting sealing agent.SOLUTION: As shown in Fig.1(A), a substrate 12 is mounted on a hot plate 20 and is preheated. After temperatures of various members such as the substrate 12, a cover 16, and an electronic component 14 increase to temperatures set by the hot plate 20, the sealing agent 30 is coated as shown in Fig.1(B). Even when an inside of the package 10 is shielded from an external after the sealing agent 30 is coated on a clearance d and sealing is completed, the internal pressure of the package 10 does not increase, and generation of the pin hole caused by a difference between the internal pressure and external pressure of uncured sealing agent 30 can be prevented because the temperatures of the substrate 12, the cover 16 or the like increase to a curable temperature of the sealing agent 30. |
