发明名称 |
CONTINUOUS ELECTROPLATING METHOD, METHOD FOR CIRCULATING PLATING SOLUTION AND CONTINUOUS ELECTROPLATING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a means for carrying out an electrode effective length increasing/decreasing step easily and surely when product kinds different in requested current density are produced by using the same electrode without increasing the maximum value of amperage in a continuous electroplating line.SOLUTION: A plurality of overflowing mechanisms are arranged in the height direction of a vertical plating tank 7 and an overflowing position of a plating solution is selected according to the product kind to raise/lower the height of a plating solution level and increase/decrease the effective length of the electrode. Each overflowing mechanism comprises an overflow pipe 8 and a gutter 10. A valve 3 is connected to the gutter 10 while interposing a pipeline 9 between them. The overflowed plating solution is introduced into a plating solution circulation tank 5 through the valve 3 and then circulated to the vertical plating tank 7 by a pump 6. In this apparatus constitution, the opening/closing operations of the respective valves 3 are combined to change the height 4 of the plating solution level. |
申请公布号 |
JP2011195914(A) |
申请公布日期 |
2011.10.06 |
申请号 |
JP20100065326 |
申请日期 |
2010.03.22 |
申请人 |
NIPPON STEEL ENGINEERING CO LTD |
发明人 |
YAMAMOTO AKIRA;NINOMIYA YOSHIFUMI |
分类号 |
C25D21/00;C25D17/00 |
主分类号 |
C25D21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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