INTER -DIE INTERCONNECTION INTERFACE

摘要

A die for use in a package is provided. The package comprises the die and at least one further die. The die has an interface configured to receive a transaction from the further die via an interconnect and to transmit a response to said transaction to said further die via the interconnect. The die also has mapping circuitry which is configured to receive at least first source identity information of the received transaction, said first source identity information being associated with a source of the transaction. The mapping circuitry is configured to modify the transaction to comprise local source identity information as source identity information for the transaction. The mapping circuitry is configured to modify said received transaction to provide said first source identity information in a further field.