| 发明名称 |
COMPOSITION FOR FORMING BOARD AND PRINTED CIRCUIT BOARD USING THE SAME |
| 摘要 |
Disclosed are a thermosetting composition including a liquid crystal oligomer, a bismaleimide-based compound, an epoxy compound, and a fluorinated polymer resin powder. A resin cured product, board, and storage medium each include the thermosetting composition. |
| 申请公布号 |
KR20110108782(A) |
申请公布日期 |
2011.10.06 |
| 申请号 |
KR20100028179 |
申请日期 |
2010.03.29 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG FINE CHEMICALS CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JUNG, MYUNG SUP;LEE, JAE JUN |
| 分类号 |
C08L65/00;C08G61/00;C08K5/151;C08K5/16 |
主分类号 |
C08L65/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
