Alkaline etching liquid for texturing a silicon wafer surface

摘要

An etching liquid for texturing a silicon wafer surface is provided. The etching liquid may include an aqueous solution of at least one alkaline etching agent and (i) at least one polysaccharide or derivative thereof and/or (ii) at least one polyalcohol comprising at least four hydroxy groups or derivative thereof. Also provided is a process for texture etching a silicon wafer using the etching liquid of the invention and the thus produced silicon wafers.