An apparatus for mounting a semiconductor device includes a mounting component and a loading component. The mounting component is configured to mount the semiconductor device onto a circuit board. The loading component is disposed adjacent to the mounting component, and is configured to supply the semiconductor device and the circuit board to the mounting component.
申请公布号
KR20110108128(A)
申请公布日期
2011.10.05
申请号
KR20100027451
申请日期
2010.03.26
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, TAE HYUN;LEE, DONG SOO;GOH, SEOK;CHO, KYOUNG BOK