发明名称 ETCHING SOLUTION FOR COPPER AND SUBSTRATE MANUFACTURING METHOD
摘要 The invention aims to provide an etching solution with which the removing performance of a seed crystal layer in the producing process of the substrate is high and undercuts are not easy to occur in the removing process of the seed crystal layer, and provide a producing method of a substrate using the etching solution. The etching solution includes a benzo triazole compound having nitro substituent, an organic amine compound, and copper having sulfuric acid and hydrogen peroxide.
申请公布号 KR20110108252(A) 申请公布日期 2011.10.05
申请号 KR20110020831 申请日期 2011.03.09
申请人 MEC COMPANY LTD. 发明人 NAKAMURA MAMI;FUJII TAKAYUKI;KODERA HIROFUMI
分类号 C23F1/18;C23C18/38 主分类号 C23F1/18
代理机构 代理人
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