发明名称 POLYMER PI-BOND-PHILIC FILLER COMPOSITES
摘要 <p>The instant invention generally provides polymer pi-bond-philic filler composite comprising a molecularly self-assembling material and a pi-bond-philic filler, and a process of making and an article comprising the polymer pi-bond-philic filler composite. The instant invention also generally provides a process of separating a pi-bond-philic gas from a separable gas mixture comprising the pi-bond-philic gas.</p>
申请公布号 EP2370196(A2) 申请公布日期 2011.10.05
申请号 EP20090764395 申请日期 2009.11.20
申请人 DOW GLOBAL TECHNOLOGIES LLC 发明人 MATTEUCCI, SCOTT, T.;FEIST, SHAWN, D.;NICKIAS, PETER, N.;LOPEZ, LEONARDO, C.;PAQUETTE, MICHAEL, S.;MUNRO, JEFFREY, C.
分类号 B01D59/12;C08J9/00;C08J9/36;C08K9/00;C08K9/04 主分类号 B01D59/12
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