发明名称 |
WAFER CHUCK INCLINATION CORRECTING METHOD AND PROBE APPARATUS |
摘要 |
A method for correcting inclination of a wafer chuck includes obtaining in advance a correction amount for each of the semiconductor chips which corrects the inclination of the wafer chuck in the case of applying a contact load to at least each one of the semiconductor chips and storing each of the correction amounts in a data storage unit; calculating a total correction amount for correcting the inclination of the wafer chuck by calculating the correction amount of each of the semiconductor chips bringing into contact with the probes when the semiconductor wafer comes into electrical contact with the probes and adding the calculated correction amounts; and correcting the inclination of the wafer chuck based on the total correction amount. |
申请公布号 |
KR20110108291(A) |
申请公布日期 |
2011.10.05 |
申请号 |
KR20110026488 |
申请日期 |
2011.03.24 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
ISHII KAZUNARI;IIJIMA TOSHIHIKO;AKIYAMA SHUJI |
分类号 |
H01L21/66;H01L21/683 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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