发明名称 Methods of fabricating coplanar waveguide structures
摘要 Methods for fabricating a coplanar waveguide structure. The method may include forming first and second ground conductors and a signal conductor in a coplanar arrangement between the first and second ground conductors, forming a first coplanar array of substantially parallel shield conductors above the signal conductor and the first and second ground conductors, and forming a second coplanar array of substantially parallel shield conductors below the signal conductor and the first and second ground conductors. The method further includes forming a first plurality of conductive bridges located laterally between the signal conductor and the first ground conductor, and forming a second plurality of conductive bridges located laterally between the signal conductor and the second ground conductor. Each of the first plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array. Each of the second plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array.
申请公布号 US8028406(B2) 申请公布日期 2011.10.04
申请号 US20080061861 申请日期 2008.04.03
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DING HANYI;MINA ESSAM F.;WANG GUOAN;WOODS WAYNE H.
分类号 H05K3/10;H01P3/00;H01P11/00 主分类号 H05K3/10
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